TOP MONOCRYSTALLINE SILICON SECRETS

Wire-saw wafer slicing is without doubt one of the critical manufacturing technologies for industrial crystalline silicon PV cells, and enhancements in wafer slicing technology have resulted in a discount in Uncooked wafer thickness from 370 μm to 180 μm since 1997 for Sharp industrial polycrystalline-silicon cells (Determine 6). To introduce waf